Chip-on-Wafer-on-Substrate,CoWoS IT-Times Yizuo Media

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Chip-on-Wafer-on-Substrate,CoWoS

1 8 months ago

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Chip-on-Wafer-on-Substrate,CoWoS

Chip-on-Wafer-on-Substrate (CoWoS) ist eine 2,5D-IC-Technologie (2,5D IC), die von TSMC für Hochleistungsanwendungen entwickelt wurde.

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